Home » Integrated Interconnect Technologies for 3D Nanoelectronic Systems by Muhannad S. Bakir
Integrated Interconnect Technologies for 3D Nanoelectronic Systems Muhannad S. Bakir

Integrated Interconnect Technologies for 3D Nanoelectronic Systems

Muhannad S. Bakir

Published November 1st 2008
ISBN : 9781596932463
Hardcover
528 pages
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 About the Book 

Book Information Todays microchips have nearly reached their performance limits. Various heat removal, power delivery, chip reliability, and input/output (I/O) signaling problems stand in the way of next-generation 3D gigascale, system-on-a-chipMoreBook Information Todays microchips have nearly reached their performance limits. Various heat removal, power delivery, chip reliability, and input/output (I/O) signaling problems stand in the way of next-generation 3D gigascale, system-on-a-chip technology, and this cutting-edge guide describes the latest breakthroughs in microfluidics, high-density compliant electrical interconnects, and nanophotonics that are converging to solve them. Engineers get full details on state-of-the-art I/O interconnects and packaging, along with the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication. It brings readers up to speed with the latest heat removal technologies including chip-scale microchannel cooling, integrated micropumps and fluidic channels, and carbon nanotube interconnects.